Comprehensively build the industry’s best foundation in the fields of “5G high-frequency engineering architecture, 56/112Gbps high-speed interconnection architecture, PI terminal electromagnetic engineering, source road load PI engineering, magnetic circuit integrity, Asic and PCB collaborative design, and signal integrity design” Component innovation capabilities support the huge changes and innovations in hardware engineering technology in the 5G era!
Job requirements
1. Major in electronics, communication, control, automation, electromagnetic field and microwave;
2. Have a good foundation in analog circuits, digital circuits, electromagnetic fields and microwaves, and signal processing.
Recruitment Requirements: Chinese Ph.D. graduates from domestic and overseas universities
Graduation time: January 1, 2022-December 31, 2023
